The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2010

Filed:

Jan. 06, 2006
Applicants:

Madhav Datta, Milpitas, CA (US);

Mark Mcmaster, Menlo Park, CA (US);

Rick Brewer, Union City, CA (US);

Peng Zhou, Albany, CA (US);

Paul Tsao, Los Altos, CA (US);

Girish Upadhaya, Austin, TX (US);

Mark Munch, Los Altos Hills, CA (US);

Inventors:

Madhav Datta, Milpitas, CA (US);

Mark McMaster, Menlo Park, CA (US);

Rick Brewer, Union City, CA (US);

Peng Zhou, Albany, CA (US);

Paul Tsao, Los Altos, CA (US);

Girish Upadhaya, Austin, TX (US);

Mark Munch, Los Altos Hills, CA (US);

Assignee:

Cooligy Inc., Mountain View, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); F28D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.


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