The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Dec. 29, 2006
Sung Min Kim, Seoul, KR;
Min Suk Suh, Seoul, KR;
Kwon Whan Han, Seoul, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
A stack package includes an edge-pad-type first semiconductor chip having bonding pads arranged near the edges thereof. A pattern die is placed on the first semiconductor chip. The pattern die is smaller in size than the first semiconductor chip and has line-type-redistribution parts formed thereon. An edge-pad-type second semiconductor chip smaller in size than the pattern die is placed on the pattern die. Bonding wires electrically connect the bonding pads of the first semiconductor chip and the redistribution parts of the pattern die and also electrically connect the redistribution parts of the pattern die and bonding pads of the second semiconductor chip.