The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Sep. 11, 2007
Shuji Asai, Kanagawa, JP;
Tadachika Hidaka, Shiga, JP;
Naoto Kurosawa, Kanagawa, JP;
Hirokazu Oikawa, Kanagawa, JP;
Takaki Niwa, Kanagawa, JP;
Shuji Asai, Kanagawa, JP;
Tadachika Hidaka, Shiga, JP;
Naoto Kurosawa, Kanagawa, JP;
Hirokazu Oikawa, Kanagawa, JP;
Takaki Niwa, Kanagawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor apparatus includes a semiconductor device formed to a first surface of a semiconductor substrate, a blocking film provided in a first via-hole, the first via-hole formed with a concave shape to the first surface of the semiconductor substrate, a first via line connected to an electrode of the semiconductor device in contact with the blocking film, a second via line formed inside a second via-hole, electrically connected with the first via line with the blocking film interposed therebetween and being apart of a wiring formed to a second surface, the second via-hole formed with a concave shape to the second surface opposing the first surface of the semiconductor substrate so as to reach the blocking film. The blocking film includes at least one kind of group 8 element.