The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Nov. 19, 2007
Sang-wook Park, Chungcheongnam-do, KR;
Seung-jae Lee, Chungcheongnam-do, KR;
Seung-yeol Yang, Gyeonggi-do, KR;
Sang-Wook Park, Chungcheongnam-do, KR;
Seung-Jae Lee, Chungcheongnam-do, KR;
Seung-Yeol Yang, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A semiconductor module preferably includes a semiconductor package and a printed circuit board (PCB). The semiconductor package can include an outer terminal. The PCB can include a terminal land that is electrically connected to the outer terminal. The PCB preferably has a recess configured to at least partially expose the terminal land and to receive the outer terminal. The recess preferably has a width that is less than a width of the semiconductor package. Damage to edge portions of the semiconductor package whose outer terminal is received into the recess may be prevented, because the edge portions make contact with and are supported by the PCB. One or more support members can also be provided to contact one or more sides of the edge portions of the semiconductor package to further prevent damage due to horizontal impacts.