The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2010

Filed:

Feb. 28, 2007
Applicants:

Thomas Detzel, Villach, AT;

Hubert Maier, Villach, AT;

Kai-alexander Schreiber, Villach, AT;

Stefan Woehlert, Villach, AT;

Uwe Hoeckele, Regensburg, DE;

Inventors:

Thomas Detzel, Villach, AT;

Hubert Maier, Villach, AT;

Kai-Alexander Schreiber, Villach, AT;

Stefan Woehlert, Villach, AT;

Uwe Hoeckele, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment includes a carrier substrate, a first interconnect layer, formed on the carrier substrate and has at least one cutout, an insulating filling layer, formed on the first interconnect layer and the carrier substrate and fills at least one cutout, an SiON layer, formed on the filling layer, and a second interconnect layer, formed over the SiON layer.


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