The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2010

Filed:

Jan. 25, 2006
Applicants:

Frank Reichenbach, Wannweil, DE;

Franz Laermer, Weil Der Stadt, DE;

Silvia Kronmueller, Schwaikheim, DE;

Christoph Schelling, Reutlingen, DE;

Tino Fuchs, Tuebingen, DE;

Christina Leinenbach, Ensdorf, DE;

Inventors:

Frank Reichenbach, Wannweil, DE;

Franz Laermer, Weil Der Stadt, DE;

Silvia Kronmueller, Schwaikheim, DE;

Christoph Schelling, Reutlingen, DE;

Tino Fuchs, Tuebingen, DE;

Christina Leinenbach, Ensdorf, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A micromechanical component having a conductive substrate, an elastically deflectable diaphragm including at least one conductive layer, which is provided over a front side of the substrate, the conductive layer being electrically insulated from the substrate, a hollow space, which is provided between the substrate and the diaphragm and is filled with a medium, and a plurality of perforation openings, which run under the diaphragm through the substrate, the perforation openings providing access to the hollow space from a back surface of the substrate, so that a volume of the medium located in the hollow space may change when the diaphragm is deflected. Also described is a corresponding manufacturing method.


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