The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Sep. 27, 2007
Kohichi Ohsumi, Shiga-Ken, JP;
Kenji Terada, Shiga-ken, JP;
Kohichi Yamazaki, Shiga-ken, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit boardaccording to the present invention includes a step of selectively forming a plating layerfor landsandon a metal foilon the printed circuit board, a step of adjusting the thickness of the plating layer, and a step of forming the metal foilinto lines. The aspect ratio of via holesformed on landsandcan be adjusted by adjusting the thickness of the landsand
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile