The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2010

Filed:

Jul. 20, 2007
Applicants:

Feng-po Tseng, Taoyuan County, TW;

Jung-mu Hsu, Penghu County, TW;

Jing-pin Pan, Hsinchu Hsien, TW;

Tzong-ming Lee, Hsinchu, TW;

Inventors:

Feng-Po Tseng, Taoyuan County, TW;

Jung-Mu Hsu, Penghu County, TW;

Jing-Pin Pan, Hsinchu Hsien, TW;

Tzong-Ming Lee, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07D 209/48 (2006.01); C08K 5/3477 (2006.01); C08K 5/07 (2006.01); B60C 1/00 (2006.01); C08F 8/30 (2006.01); H01B 3/40 (2006.01); C07F 9/659 (2006.01); B32B 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a halogen-free and thermal resistant composition, including a mixture of bismaleimide and maleimide with molar ratio of 99:1-50:50; a barbituric acid, wherein the molar ratio of the mixture and the barbituric acid is 93:7-80:20; and an epoxy resin, wherein (the mixture with the barbituric acid) and the epoxy resin have a weight ratio of 5:95 to 50:50. The mixture undergoes reaction at 110-130° C. for about 2˜7 hours to form a maleimide modified epoxy resin. The procedure of forming the composition is solvent-free, thereby providing improved integrity for electronic packaging, lower curing temperature, and a simplified process.


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