The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Aug. 07, 2007
Masahiro Aoyagi, Ibaraki, JP;
Hiroshi Nakagawa, Ibaraki, JP;
Kazuhiko Tokoro, Ibaraki, JP;
Katsuya Kikuchi, Ibaraki, JP;
Yoshikuni Okada, Ibaraki, JP;
Masahiro Aoyagi, Ibaraki, JP;
Hiroshi Nakagawa, Ibaraki, JP;
Kazuhiko Tokoro, Ibaraki, JP;
Katsuya Kikuchi, Ibaraki, JP;
Yoshikuni Okada, Ibaraki, JP;
Abstract
An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.