The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Jun. 12, 2008
Kyung Taeg Han, Kyungki-do, KR;
Myoung Soo Choi, Seoul, KR;
Seon Goo Lee, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Seong Yeon Han, Kyungki-do, KR;
Chang Ho Song, Seoul, KR;
Young Sam Park, Seoul, KR;
Kyung Taeg Han, Kyungki-do, KR;
Myoung Soo Choi, Seoul, KR;
Seon Goo Lee, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Seong Yeon Han, Kyungki-do, KR;
Chang Ho Song, Seoul, KR;
Young Sam Park, Seoul, KR;
Samsung LED Co., Ltd., Gyunggi-do, KR;
Abstract
The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.