The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
Oct. 25, 2005
Xiaoyu MI, Kawasaki, JP;
Norinao Kouma, Kawasaki, JP;
Osamu Tsuboi, Kawasaki, JP;
Masafumi Iwaki, Kawasaki, JP;
Hisao Okuda, Kawasaki, JP;
Hiromitsu Soneda, Kawasaki, JP;
Satoshi Ueda, Kawasaki, JP;
Ippei Sawaki, Kawasaki, JP;
Xiaoyu Mi, Kawasaki, JP;
Norinao Kouma, Kawasaki, JP;
Osamu Tsuboi, Kawasaki, JP;
Masafumi Iwaki, Kawasaki, JP;
Hisao Okuda, Kawasaki, JP;
Hiromitsu Soneda, Kawasaki, JP;
Satoshi Ueda, Kawasaki, JP;
Ippei Sawaki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of making a microstructure with thin wall portions (T-T) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer () and a second conductive layer () having a thickness of the thin wall portions (T-T), where the etching is performed from the side of the first conductive layer () thereby forming in the second conductive layer () pre thin wall portions (T-T) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer () and contact the first conductive layer (). The method also includes a step of performing a second etching process from the side of the first conductive layer () for removing part of the first conductive layer () contacting the pre thin wall portions (T-T) to form the thin wall portions.