The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Jul. 31, 2007
Siew S. Hiew, San Jose, CA (US);
Jim C. NI, San Jose, CA (US);
Paul Hsueh, Concord, CA (US);
Charles C. Lee, Cupertino, CA (US);
Ming-shiang Shen, Taipei Hsien, TW;
Siew S. Hiew, San Jose, CA (US);
Jim C. Ni, San Jose, CA (US);
Paul Hsueh, Concord, CA (US);
Charles C. Lee, Cupertino, CA (US);
Ming-Shiang Shen, Taipei Hsien, TW;
Super Talent Electronics, Inc., San Jose, CA (US);
Abstract
An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.