The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2010

Filed:

Feb. 27, 2008
Applicant:

Mitsuyasu Enomoto, Anjo, JP;

Inventor:

Mitsuyasu Enomoto, Anjo, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a circuit board, a wiring part, a protective coating glass, and a resin part. The circuit board has an approximately rectangular shape. The protective coating glass is disposed on the circuit board and is arranged on an inside of the circuit board in such a manner that an outer-peripheral end of the protective coating glass is away from each of four sides of the circuit board at a first distance and is away from each of four corners of the circuit board at a second distance that is larger than the first distance. The resin part seals the circuit board, the wiring part, and the protective coating glass in such a manner that an outer-peripheral end portion of the circuit board that is located on an outside of the protective coating glass directly contact with the resin part.


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