The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Sep. 06, 2005
Ross K. Wilcoxon, Cedar Rapids, IA (US);
Alan P. Boone, Swisher, IA (US);
James R. Wooldridge, Cedar Rapids, IA (US);
Ross K. Wilcoxon, Cedar Rapids, IA (US);
Alan P. Boone, Swisher, IA (US);
James R. Wooldridge, Cedar Rapids, IA (US);
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Abstract
A tamper resistant semiconductor package includes a surface having flip chip electrical contacts. A flip chip semiconductor of the package also has flip chip electrical contacts. The flip chip semiconductor has a maximum temperature to which it can be exposed before being damaged. Flip chip solder joints physically couple and electrically connect the flip chip electrical contacts of the flip chip semiconductor to the flip chip electrical contacts of the surface. The flip chip solder joints are formed of an alloy having a higher melting point than the maximum temperature such that removal of the flip chip semiconductor from the surface by heating will destroy the functionality of the flip chip semiconductor.