The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Nov. 12, 2008
Chuan-cheng Hsiao, Hsinchu, TW;
Hung-sung LI, Hsinchu County, TW;
I-cheng Lin, Hsinchu, TW;
Che-yuan Jao, Hsinchu, TW;
Chuan-Cheng Hsiao, Hsinchu, TW;
Hung-Sung Li, Hsinchu County, TW;
I-Cheng Lin, Hsinchu, TW;
Che-Yuan Jao, Hsinchu, TW;
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
An integrated circuit includes: a substrate; and a bond pad array on the substrate. The bond pad array includes: a row of inner bond pads, each inner bond pad positioned with respect to a plurality of inner pad openings; a plurality of first inner metal layers respectively coupled to the inner bond pads for transmitting signals between the inner pads and an internal circuit, where at least one first inner metal layer has a width less than a width of a corresponding inner bond pad; a row of outer bond pads, staggered with respect to the row of inner bond pads; and a plurality of first outer metal layers respectively coupled to the outer bond pads for transmitting signals between the outer pads and the internal circuit, where at least one inner bond pad overlaps adjacent first outer metal layers.