The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7830001 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 09, 2010

Filed:

May. 23, 2006
Applicants:

Masayuki Yokota, Suita, JP;

Kazuhiro Shiomi, Suita, JP;

Fumiaki Kikui, Suita, JP;

Masaaki Ishio, Suita, JP;

Inventors:

Masayuki Yokota, Suita, JP;

Kazuhiro Shiomi, Suita, JP;

Fumiaki Kikui, Suita, JP;

Masaaki Ishio, Suita, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A Cu—Mo substrateaccording to the present invention includes: a Cu basecontaining Cu as a main component; an Mo base having opposing first and second principal facesand containing Mo as a main component, the second principal faceof the Mo basebeing positioned on at least a portion of a principal faceof the Cu base; and a first Sn—Cu-type alloy layercovering the first principal faceand side facesandof the Mo base, the first Sn—Cu-type alloy layercontaining no less than 1 mass % and no more than 13 mass % of Sn.


Find Patent Forward Citations

Yokota, Masayuki. (2010). Cu-mo substrate and method for producing same (U.S. Patent No. 7830001). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7830001

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