The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2010

Filed:

May. 30, 2006
Applicants:

Jun Watanabe, Shibukawa, JP;

Kimihiko Yoda, Shibukawa, JP;

Kazuhiro Oshima, Shibukawa, JP;

Inventors:

Jun Watanabe, Shibukawa, JP;

Kimihiko Yoda, Shibukawa, JP;

Kazuhiro Oshima, Shibukawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/50 (2006.01); C08F 2/46 (2006.01); C08J 3/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

An energy ray-curable resin composition comprising (A) a (meth)acrylate having a molecular weight of from 500 to 5,000, of which the main chain backbone is at least one member selected from the group consisting of a polybutadiene, a polyisoprene and hydrogenated products thereof and which has at least one (meth)acryloyl group at an end of the main chain backbone or in a side chain, (B) a monofunctional (meth)acrylate having a Cunsaturated hydrocarbon group via an ester bond, (C) a hydroxyl group-containing (meth)acrylate, (D) a polyfunctional (meth)acrylate, (E) a photopolymerization initiator, and (F) an antioxidant which exhibits equally high adhesive strength to various objects to be bonded, has good heat and moisture resistance, excellent rigidity, low cure shrinkage and little adhesion strain is provided.


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