The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2010

Filed:

Apr. 12, 2006
Applicants:

Julio Santarén Romé, Madrid, ES;

Francisco Javier Limpo Orozco, Madrid, ES;

Eduardo Aguilar Díez, Madrid, ES;

Antonio Álvarez Berenguer, Madrid, ES;

José Moya Corral, Madrid, ES;

Carlos Pecharroman Garcia, Madrid, ES;

Inventors:
Assignee:

Tolsa, S.A., Madrid, ES;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 21/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a method of preparing metallic nanoparticles and to the materials thus obtained. More specifically, the invention relates to a method of preparing metallic nanoparticles consisting in: selecting a precursor from the salts, hydroxides and oxides of metallic elements that can be reduced at temperatures below the clay silicate network destruction temperature; and depositing said precursor on a support selected from pseudolaminar phyllosilicate clays. According to the invention the method comprises: (i) a deposition step in which the precursor is deposited on the support: (ii) when the precursor is selected from among salts and hydroxides, a thermal decomposition step in a controlled atmosphere, in which the precursor is subjected to a decomposition process and is transformed into an oxide of the metallic element: and (iii) a reduction step in which the oxide of the metallic element is subjected to a reduction process in a controlled atmosphere. The aforementioned method is performed at temperatures below the clay silicate network destruction temperature.


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