The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2010

Filed:

Nov. 07, 2007
Applicants:

Markus Hammer, Pielenhofen, DE;

Guenther Ruhl, Regensburg, DE;

Andreas Strasser, Regensburg, DE;

Michael Melzl, Neutraubling, DE;

Reinhard Goellner, Regensburg, DE;

Doerthe Groteloh, Regensburg, DE;

Inventors:

Markus Hammer, Pielenhofen, DE;

Guenther Ruhl, Regensburg, DE;

Andreas Strasser, Regensburg, DE;

Michael Melzl, Neutraubling, DE;

Reinhard Goellner, Regensburg, DE;

Doerthe Groteloh, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed.


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