The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2010

Filed:

Feb. 29, 2008
Applicants:

Melvy F. Miller, Tempe, AZ (US);

Daniel N. Koury, Jr., Mesa, AZ (US);

Lianjun Liu, Chandler, AZ (US);

Inventors:

Melvy F. Miller, Tempe, AZ (US);

Daniel N. Koury, Jr., Mesa, AZ (US);

Lianjun Liu, Chandler, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectromechanical systems (MEMS) componentincludes a portionof a MEMS structureformed on a semiconductor substrateand a portionof the structureformed in a non-semiconductor substrate. The non-semiconductor substrateis in fixed communication with the semiconductor substratewith the portionof the MEMS structurebeing interposed between the substratesand. A fabrication methodentails utilizing semiconductor thin-film processing techniques to form the portionon the semiconductor substrate, and utilizing a lower cost processing technique to fabricate the portionin the non-semiconductor substrate. The portionsandare coupled to yield the MEMS structure, and the MEMS structurecan be attached to another substrate as needed for additional functionality.


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