The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Apr. 21, 2005
Applicants:
Takuo Funaya, Tokyo, JP;
Osamu Myohga, Tokyo, JP;
Koji Matsui, Tokyo, JP;
Inventors:
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 13/00 (2006.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
Abstract
An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.