The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Dec. 06, 2006
Yoshihiro Kawakita, Osaka, JP;
Toshiaki Takenaka, Kyoto, JP;
Yoshihiro Kawakita, Osaka, JP;
Toshiaki Takenaka, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness tof the prepreg sheet, the minimum diameter rof the through-hole, the thickness tof the first film, the diameter rof the first hole, the thickness tof the second film, the diameter rof the second hole satisfy a relation: r/t≧3, r/t≧3, and r/(t+t+t)≦1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.