The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2010
Filed:
Dec. 05, 2008
Yoshihiro Kondo, Tsuchiura, JP;
Akio Idei, Hatano, JP;
Shigeyasu Tsubaki, Odawara, JP;
Hitoshi Matsushima, Ryugasaki, JP;
Tadakatsu Nakajima, Kasumigaura, JP;
Hiroyuki Toyoda, Hitachinaka, JP;
Tomoo Hayashi, Hitachinaka, JP;
Tatsuya Saito, Kunitachi, JP;
Takeshi Kato, Akishima, JP;
Kenji Ogiro, Yokohama, JP;
Yoshihiro Kondo, Tsuchiura, JP;
Akio Idei, Hatano, JP;
Shigeyasu Tsubaki, Odawara, JP;
Hitoshi Matsushima, Ryugasaki, JP;
Tadakatsu Nakajima, Kasumigaura, JP;
Hiroyuki Toyoda, Hitachinaka, JP;
Tomoo Hayashi, Hitachinaka, JP;
Tatsuya Saito, Kunitachi, JP;
Takeshi Kato, Akishima, JP;
Kenji Ogiro, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.