Terminal structure of chiplike electric component

Abstract

A terminal structure of a chip-like electric component capable of blocking entry of electromigration-causing factors through an insulating resin layer in the vicinity of the peak of a raised portion of an electrical element forming layer is obtained. A metal-glaze-based front electrodecontaining silver is provided on a surface of an insulating ceramic substrate. A resistor layerelectrically connected to the front electrodeis provided on the substrate surface. A glass layeris provided to completely cover a surface of the resistor layeras well as a surface of an end portion of the resistor layerand also to partially cover the front electrode. An insulating resin layeris provided to cover a surface of the glass layeras well as a surface of at least an end portion of the glass layerand to partially cover the front electrode. A conductive layermade of a resin-based conductive paint is provided to extend over the surface of the front electrodeand an portion of the insulating resin layerin the vicinity of the peak of raised end portion of the insulating resin layer. The resin-based conductive paint is made by kneading particulate conductive silver powder and scale-like conductive silver powder into an epoxy-based insulating resin paint.