The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2010

Filed:

Mar. 30, 2007
Applicants:

Anton Doering, Reutlingen, DE;

Stefan Mueller, Wasserburg, DE;

Frieder Haag, Wannweil, DE;

Christoph Gahn, Stuttgart, DE;

Inventors:

Anton Doering, Reutlingen, DE;

Stefan Mueller, Wasserburg, DE;

Frieder Haag, Wannweil, DE;

Christoph Gahn, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor system or sensor system in a housing which is butt-joined to a printed circuit board by soldering, at least some of the connecting surfaces not being soldered over their entire area, the connecting surfaces which are not soldered over their entire area being fixedly soldered in a first surface region to a section of a printed conductor, and in a second surface region the connecting surfaces not being fixedly connected to the printed circuit board, the securely soldered surface regions being situated closer to the semiconductor or sensor structure to be contacted than are the surface regions which are not fixedly connected to the printed circuit board.


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