The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2010
Filed:
Apr. 27, 2007
Yikui (Jen) Dong, Cupertino, CA (US);
Steven L. Howard, Fort Collins, CO (US);
Freeman Y. Zhong, San Ramon, CA (US);
David S. Lowrie, San Jose, CA (US);
Yikui (Jen) Dong, Cupertino, CA (US);
Steven L. Howard, Fort Collins, CO (US);
Freeman Y. Zhong, San Ramon, CA (US);
David S. Lowrie, San Jose, CA (US);
LSI Corporation, Milpitas, CA (US);
Abstract
A device fabricated on a chip is disclosed. The device generally includes (A) a first pattern and a second pattern both created in an intermediate conductive layer of the chip, (B) at least one via created in an insulating layer above the intermediate conductive layer and (C) a first bump created in a top conductive layer above the insulating layer. The first pattern generally establishes a first of a plurality of plates of a first capacitor. The via may be aligned with the second pattern. The first bump may (i) be located directly above the first plate, (ii) establish a second of the plates of the first capacitor, (iii) be suitable for flip-chip bonding and (iv) connect to the second pattern through the via such that both of the plates of the first capacitor are accessible in the intermediate conductive layer.