The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2010

Filed:

Mar. 27, 2006
Applicants:

Erich Syri, Wenzenbach, DE;

Gerold Gruendler, Regensburg, DE;

Juergen Hoegerl, Regensburg, DE;

Thomas Killer, Hohenschambach, DE;

Volker Strutz, Tegernheim, DE;

Inventors:

Erich Syri, Wenzenbach, DE;

Gerold Gruendler, Regensburg, DE;

Juergen Hoegerl, Regensburg, DE;

Thomas Killer, Hohenschambach, DE;

Volker Strutz, Tegernheim, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.


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