The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7825031 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 02, 2010

Filed:

Sep. 14, 2007
Applicants:

Dirk Manger, Dresden, DE;

Rolf Weis, Dresden, DE;

Christoph Noelscher, Nuremberg, DE;

Inventors:

Dirk Manger, Dresden, DE;

Rolf Weis, Dresden, DE;

Christoph Noelscher, Nuremberg, DE;

Assignee:

Qimonda AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a method of fabricating an integrated circuit, including the steps of providing at least one layer; performing a first implantation step, wherein particles are implanted into the layer under a first direction of incidence; performing a second implantation step, wherein particles are implanted into the layer under a second direction of incidence which is different from the first direction of incidence; performing a removal step, wherein the layer is partially removed depending on the local implant dose generated by the first and the second implantation step.


Find Patent Forward Citations

Manger, Dirk. (2010). Method of fabricating a semiconductor device (U.S. Patent No. 7825031). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7825031

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…