The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2010
Filed:
May. 15, 2007
Applicants:
Makoto Tsuji, Kanagawa-ken, JP;
Hiroshi Yokoyama, Kanagawa-ken, JP;
Shinya Itani, Shizuoka-ken, JP;
Inventors:
Assignee:
Toshiba Kikai Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/48 (2006.01); B29C 49/56 (2006.01);
U.S. Cl.
CPC ...
Abstract
A mold clamping apparatus for a die casting machine is provided. The apparatus can include a base, a fixed die plate standing fixedly on an end of an injection side of the base and defining a cavity therein, and a moving die plate arranged so as to proceed and retract on the base facing the fixed die plate and defining a cavity therein. A first versatile main mold can be disposed in the cavity of the fixed die plate and adapted to receive an insert die. Further, a second versatile main mold can be disposed in the cavity of the moving die plate and adapted to receive an insert die.