The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Feb. 02, 2007
Takeo Hayashi, Tokyo, JP;
Takeo Hayashi, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device including a multi-layer interconnection substrate having a signal distribution interconnection and a power supply line and semiconductor circuit blocks installed on the multi-layer interconnection substrate for performing required operations. The multi-layer substrate includes a third interconnection layer having interconnections extending in a first direction, a second interconnection layer having interconnections extending in a second direction which is different to the first direction, and a first interconnection layer having interconnections extends in a direction orthogonal to the first direction.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile