The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2010

Filed:

Jun. 21, 2006
Applicants:

Toshihiro Moriya, Nara, JP;

Hirotaka Wada, Nara, JP;

Takako Onishi, Kyoto, JP;

Atsushi Shimizu, Yokohama, JP;

Akira Nakajima, Otsu, JP;

Inventors:

Toshihiro Moriya, Nara, JP;

Hirotaka Wada, Nara, JP;

Takako Onishi, Kyoto, JP;

Atsushi Shimizu, Yokohama, JP;

Akira Nakajima, Otsu, JP;

Assignee:

OMRON Corporation, Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

For each teaching image, a plurality of patterns of color pickup regions each include a first region for picking up a color of a first part and a second region for picking up a color of a second part are set, the color of each pixel in the first region and the color of each pixel in the second region are mapped as a target point and an exclusion point respectively, to a color space for each of the patterns of the color pickup regions, a degree in separation between a target point distribution and an exclusion point distribution in the color space is calculated for each of the patterns of the color pickup regions, a pattern of a color pickup region having a maximum degree in separation is selected, a color range which divides the color space and has the largest difference between the number of target points and the number of exclusion points in the selected pattern therein is found, and the found color range is set as a color condition used in a board inspecting process.


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