The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Feb. 01, 2006
Yasuhiro Sugaya, Osaka, JP;
Yoshiyuki Yamamoto, Osaka, JP;
Toshiyuki Asahi, Osaka, JP;
Katsumasa Miki, Osaka, JP;
Masaaki Katsumata, Osaka, JP;
Yoshiyuki Saitou, Osaka, JP;
Takeshi Nakayama, Hyogo, JP;
Yasuhiro Sugaya, Osaka, JP;
Yoshiyuki Yamamoto, Osaka, JP;
Toshiyuki Asahi, Osaka, JP;
Katsumasa Miki, Osaka, JP;
Masaaki Katsumata, Osaka, JP;
Yoshiyuki Saitou, Osaka, JP;
Takeshi Nakayama, Hyogo, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.