The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Apr. 16, 2008
Clem H. Brown, Scottsdale, AZ (US);
Vasile R. Thompson, Tempe, AZ (US);
Clem H. Brown, Scottsdale, AZ (US);
Vasile R. Thompson, Tempe, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A semiconductor package () includes an organic substrate () and a semiconductor die subassembly (). A method () for making the semiconductor package () entails providing () the organic substrate () having an opening () and electrical contacts (). The subassembly () is formed by producing () a semiconductor die () and bonding it to a platform layer (). An elastomeric adhesive () is utilized () to secure the subassembly () in the opening (). Electrical interconnects () are provided () between the semiconductor die () and the electrical contacts () of the organic substrate (). The organic substrate (), semiconductor die (), elastomeric adhesive (), and electrical interconnects () are encapsulated () in a packaging material (). The elastomeric adhesive () provides mechanical anchoring of the subassembly () to the substrate () and provides mechanical stress isolation of the semiconductor die () within the semiconductor package ().