The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Mar. 20, 2009
Kazuo Teshirogi, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A manufacturing method of a semiconductor device includes providing an adhesive on a supporting board, the supporting board being where a semiconductor element is to be mounted; providing a member configured to block flow of the adhesive on a first main surface of the semiconductor element, the semiconductor element having a second main surface where an outside connection terminal is provided; mounting the semiconductor element on a part of the supporting board where the adhesive is provided by pressing the semiconductor element via the member.