The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2010

Filed:

Dec. 26, 2003
Applicants:

Kenichi Ishibashi, Kanagawa, JP;

Yuichi Tokita, Kanagawa, JP;

Masahiro Morooka, Kanagawa, JP;

Yusuke Suzuki, Kanagawa, JP;

Kazuhiro Noda, Kanagawa, JP;

Inventors:

Kenichi Ishibashi, Kanagawa, JP;

Yuichi Tokita, Kanagawa, JP;

Masahiro Morooka, Kanagawa, JP;

Yusuke Suzuki, Kanagawa, JP;

Kazuhiro Noda, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A paste in which semiconductor fine grain such as titanium oxide fine grain or the like and a binder made of a polymer compound are mixed is coated onto a transparent conductive substrate and sintered, thereby forming a semiconductor layer made of the semiconductor fine grain, after that, ultraviolet rays are irradiated to the semiconductor layer and, by using a photocatalyst effect of the semiconductor fine grain, an organic substance remaining in the semiconductor layer is removed.


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