The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Sep. 08, 2005
Motohiko Suzuki, Shimonoseki, JP;
Hiroshi Sakamoto, Shimonoseki, JP;
Yukio Sugishita, Shimonoseki, JP;
Riichi Tsuno, Shimonoseki, JP;
Motohiko Suzuki, Shimonoseki, JP;
Hiroshi Sakamoto, Shimonoseki, JP;
Yukio Sugishita, Shimonoseki, JP;
Riichi Tsuno, Shimonoseki, JP;
Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe-shi, JP;
Abstract
There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 μm and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 μm, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%.