The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Mar. 13, 2007
David Christopher Graham, Lexington, KY (US);
Eric Spencer Hall, Lexington, KY (US);
Gary Anthony Holt, Jr., Lexington, KY (US);
Richard Leo Hubert, Ii, Lexington, KY (US);
Johnny Dale Massie, Lexington, KY (US);
Sean Terrance Weaver, Union, KY (US);
Jonathan Harold Laurer, Boone, NC (US);
Rich Wells, Westerville, OH (US);
David Christopher Graham, Lexington, KY (US);
Eric Spencer Hall, Lexington, KY (US);
Gary Anthony Holt, Jr., Lexington, KY (US);
Richard Leo Hubert, II, Lexington, KY (US);
Johnny Dale Massie, Lexington, KY (US);
Sean Terrance Weaver, Union, KY (US);
Jonathan Harold Laurer, Boone, NC (US);
Rich Wells, Westerville, OH (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).