The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Apr. 17, 2008
Hiroshi Yamaguchi, Kyoto, JP;
Katsumi Fujima, Tsukuba, JP;
Nelson Mugabi, Ryugasaki, JP;
Choiku Yoshikawa, Kashiwa, JP;
Hiroshi Yamaguchi, Kyoto, JP;
Katsumi Fujima, Tsukuba, JP;
Nelson Mugabi, Ryugasaki, JP;
Choiku Yoshikawa, Kashiwa, JP;
Mayekawa Mfg. Co., Ltd., , JP;
The Doshisha, , JP;
Abstract
A COcooling and heating apparatus and method permit simultaneous production of high-temperature heat source and low-temperature heat source having a temperature difference therebetween. The apparatus/method uses CO(carbon dioxide) as a refrigerant, and has a first refrigerating cycle circuit where the refrigerant is compressed to a supercritical zone and then decompressed via an expansion device to a pressure/temperature level of the COtriple point or below to thereby attain evaporation. The apparatus can include multistage compressors, intermediate cooler disposed in a first refrigerant flow path between a condenser and the expansion device. A second refrigerating cycle circuit having a second refrigerant flow path, which can branch off from the first refrigerant flow path or provided in an independent closed circuit, can be provided to carry out absorption of evaporation latent heat with the first refrigerant flow path to thereby maintain the pressure/temperature level of the COtriple point (Ptr) or above. A third refrigerating cycle circuit having a third refrigerant flow path also can be provided to carry out heat exchange with the second refrigerant flow path.