The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2010

Filed:

Dec. 22, 2005
Applicants:

Kaoru Sakinada, Suzaka, JP;

Takumi Kooriike, Suzaka, JP;

Shunichi Aikawa, Suzaka, JP;

Osamu Kawachi, Yokohama, JP;

Yasufumi Kaneda, Yokohama, JP;

Inventors:

Kaoru Sakinada, Suzaka, JP;

Takumi Kooriike, Suzaka, JP;

Shunichi Aikawa, Suzaka, JP;

Osamu Kawachi, Yokohama, JP;

Yasufumi Kaneda, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.


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