The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Oct. 02, 2007
Markus Thoben, Soest, DE;
Richard Boettcher, Warstein, DE;
Marc Buschkuehle, Erwitte, DE;
Hartwig Rueckert, Soest, DE;
Markus Thoben, Soest, DE;
Richard Boettcher, Warstein, DE;
Marc Buschkuehle, Erwitte, DE;
Hartwig Rueckert, Soest, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
One embodiment provides a semiconductor module with an electrically insulating substrate. A conductor track is arranged on the substrate. A semiconductor chip and sleeve member are arranged on the substrate and electrically connected to the conductor track. The sleeve member includes a rim with a maximum inner diameter. The module further includes a contact element. The contact element includes a first end arranged within and electrically connected to the sleeve member, a second end providing an external contact of the module, and a section arranged between the first end and the second end. The section includes a maximum outer diameter that is larger than the maximum inner diameter of the rim. The contact element is in mechanical contact with the sleeve member such that the section between both ends of the contact element is arranged outside the sleeve member and borne on the rim of the sleeve member.