The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Dec. 01, 2006
Masanori Minamio, Osaka, JP;
Noboru Takeuchi, Kyoto, JP;
Kenichi Itou, Osaka, JP;
Toshiyuki Fukuda, Kyoto, JP;
Hideki Sakota, Kyoto, JP;
Masanori Minamio, Osaka, JP;
Noboru Takeuchi, Kyoto, JP;
Kenichi Itou, Osaka, JP;
Toshiyuki Fukuda, Kyoto, JP;
Hideki Sakota, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.