The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Sep. 25, 2007
Applicant:
Swee Kwang Chua, Singapore, SG;
Inventor:
Swee Kwang Chua, Singapore, SG;
Assignee:
Aptina Imaging Corporation, Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2006.01); H01L 23/12 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Thin semiconductor die packages and associated systems and methods are disclosed. A package in accordance with a particular embodiment includes a semiconductor die having die bond sites, a conductive structure positioned proximate to the semiconductor die and having first bond sites and second bond sites spaced apart from the first bond sites, and conductive couplers connected between the first bond sites of the conductive structure and the die bond sites of the semiconductor die. A cover can be positioned adjacent to the semiconductor die, and can include a recess in which the conductive couplers are received.