The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7816704 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 19, 2010

Filed:

Nov. 12, 2008
Applicants:

Tsang-lin Hsu, Taipei Hsien, TW;

Heng-i Lin, Taipei Hsien, TW;

Inventors:

Tsang-Lin Hsu, Taipei Hsien, TW;

Heng-I Lin, Taipei Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for packaging a light emitting element includes a step of providing a carrier formed with an anode electrode and a cathode electrode, a step of providing a light emitting object by utilizing a light emitting diode chip having a positive and negative electrodes, a step of directly contacting the carrier and the light emitting diode chip to establish electrical communication among the anode and cathode electrodes and the positive and negative electrodes, and a step of firmly bonding the carrier and the light emitting diode chip by which to simplify assembling procedure and further to reduce manufacturing cost and enhance production efficiency.


Find Patent Forward Citations

Quick Actions:

Hsu, Tsang-Lin. (2010). Method for packaging a light emitting device including a metal reflection layer and a metal heat dissipation layer (U.S. Patent No. 7816704). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7816704

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…