The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
May. 10, 2007
Applicants:
Kuen Yuan Hwang, Hsinchu, TW;
An Pang Tu, Hsinchu, TW;
Sheng Yen Wu, Hsinchu, TW;
Inventors:
Assignee:
Chang Chun Plastics Co., Ltd., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 3/38 (2006.01); C08K 3/40 (2006.01); G08G 18/77 (2006.01);
U.S. Cl.
CPC ...
Abstract
A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.