The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Sep. 29, 2003
Yasuyuki Mizuno, Ibaraki, JP;
Daisuke Fujimoto, Ibaraki, JP;
Hiroshi Shimizu, Ibaraki, JP;
Kazuhito Kobayashi, Ibaraki, JP;
Takayuki Sueyoshi, Kagoshima, JP;
Yasuyuki Mizuno, Ibaraki, JP;
Daisuke Fujimoto, Ibaraki, JP;
Hiroshi Shimizu, Ibaraki, JP;
Kazuhito Kobayashi, Ibaraki, JP;
Takayuki Sueyoshi, Kagoshima, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.