The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Jun. 02, 2008
Cheng-hong Su, Taipei, TW;
Cheng-Hong Su, Taipei, TW;
Silitek Electronic (Guangzhou) Co., Ltd., Guangzhou, CN;
Lite-On Technology Corporation, Taipei, TW;
Abstract
A packaging apparatus for optical-semiconductors includes a mold base having a longitudinal receiving space, an encapsulating module attached to the mold base, and a fixing member attached to the encapsulating module. The bottom of the mold base has at least one air-vent and the mold base has a predetermined width. The encapsulating module includes a plate engaged with the mold base, a plurality of molding bodies penetrating the plate and received in the receiving space, and a plurality of supporting members connected to the molding bodies. The fixing member has a plurality of holding slots to hold the supporting members so that the supporting members are more stable. Furthermore, the width of the mold base is optimized with the dimension of a furnace so that the production rate is increased and the stability of the packaging structure is improved.