The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Sep. 09, 2008
Akihiro Kimura, Yokohama, JP;
Masahiro Tagawa, Isehara, JP;
Nobuhiro Ito, Yamato, JP;
Takayuki Ogawara, Atsugi, JP;
Tomonori Nakazawa, Atsugi, JP;
Akihiro Kimura, Yokohama, JP;
Masahiro Tagawa, Isehara, JP;
Nobuhiro Ito, Yamato, JP;
Takayuki Ogawara, Atsugi, JP;
Tomonori Nakazawa, Atsugi, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of manufacturing a hermetically sealed container including a pair of substrates disposed in opposition to each other, a frame member disposed between the pair of substrates, and a bonding member bonding the substrate to the frame member, includes a bonding step of heating the bonding member for bonding the substrate to the frame member. The bonding step includes a measuring process for measuring a height of the bonding member in a direction perpendicular to the substrate, and a heating and pressing process for partially pressing the substrate to the bonding member while partially heating the bonding member. The heating and pressing process is conducted by scanning, along the bonding member, an area of the bonding member partially heated and an area of the substrate partially pressed. During the heating and pressing process, the pressure exerted on the substrate is controlled based on the measured height of the bonding member measured such that a constant pressure is exerted between the substrate and the bonding member.