The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2010

Filed:

Sep. 30, 2008
Applicants:

Bily Wang, Hsinchu, TW;

Shih-yu Wu, Banciao, TW;

Wen-kuei Wu, Hukou Township, Hsinchu County, TW;

Inventors:

Bily Wang, Hsinchu, TW;

Shih-Yu Wu, Banciao, TW;

Wen-Kuei Wu, Hukou Township, Hsinchu County, TW;

Assignee:

Harvatek Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 5/00 (2006.01); G09G 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for calculating out an optimum arrangement pitch between each two LED chip package units, including: providing a backlight module with a predetermined brightness value and a predetermined material information that a customer needs; determining what brightness level and amount of LED chip package units need to be used by a designer according to the brightness value and the material information of the backlight module; and dividedly arranging the LED chip package units determined by the designer on a light-entering area of the backlight module in order to define what the optimum arrangement pitch between each two LED chip package units is.


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