The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Jul. 18, 2008
Toru Mizuno, Tokyo, JP;
Tomomi Asakura, Tokyo, JP;
Yuji Saito, Tokyo, JP;
Hiroyuki Takano, Tokyo, JP;
Toshinobu Miyagoshi, Tokyo, JP;
Toru Mizuno, Tokyo, JP;
Tomomi Asakura, Tokyo, JP;
Yuji Saito, Tokyo, JP;
Hiroyuki Takano, Tokyo, JP;
Toshinobu Miyagoshi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.