The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2010

Filed:

Nov. 10, 2008
Applicants:

Andrew E. Fisk, Philadelphia, PA (US);

Richard X. Fu, Ellicott City, MD (US);

Christine A. Frysz, Orchard Park, NY (US);

Inventors:

Andrew E. Fisk, Philadelphia, PA (US);

Richard X. Fu, Ellicott City, MD (US);

Christine A. Frysz, Orchard Park, NY (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A feedthrough filter capacitor assembly is described. The feedthrough filter capacitor assembly comprises an outer ferrule hermetically sealed to an insulator of a dielectric material seated within the ferrule. The insulative material is also hermetically sealed to at least one lead wire. Instead of being made of platinum or platinum/iridium, the lead wire comprises a core of a non-noble metal supporting a functionally graded coating. The metal core has an inner layer of the same the non-noble metal of the core and an outer layer of a noble metal. A gradient transition zone exists between the non-noble metal and the outer noble metal. Consequently, lead wires having all the beneficial attributes of platinum and platinum/iridium wire can be built into hermetic feedthroughs, but at a significantly reduced cost. In a preferred form, a filter capacitor is mounted on the insulator and electrically connected to the lead wires and to the ferrule to prevent unwanted EMI signals from traveling along the wires and entering the interior of the medical device.


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